April 25, 2025, 1:20 pm
TSMC has unveiled its cutting‐edge 1.4nm chip process in an ambitious stride to outpace competitors. The announcement outlines plans for production targeting 2028 and highlights a roadmap designed to push innovation boundaries amidst a fiercely competitive semiconductor industry.
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TSMC claims N2 defect density is lower than N3 defect density two quarters before mass production starts, reveals N2 HVM time frame.
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The roadmap was unveiled this week at the North American Technology Symposium. As part of the announcement, TSMC revealed plans for an intermediary A16 node, slated for release in late 2026. This node will serve as a stepping stone toward the more transformative A14 process.Read Entire Article
permalink / 4 stories from 3 sources in 4 days ago #chips #technology
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